Rem Automation Technology (Shanghai) Co., Ltd
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    3rd Floor, Building 3, No. 666 Kangqiao Road, Pudong New Area, Shanghai
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UV laser marking machine (specifically designed for the mask industry)
UV laser marking machine (specifically designed for the mask industry)
Product details

The ultraviolet laser marking machine belongs to the series of laser marking machines, but it is developed using a 355nm ultraviolet laser. Compared with infrared laser, this machine adopts third-order intracavity frequency doubling technology. The 355 ultraviolet focused spot is extremely small, which can greatly reduce the mechanical deformation of materials and have a small impact on processing heat. Because it is mainly used for ultra-fine marking and engraving, it is particularly suitable for application fields such as food and pharmaceutical packaging material marking, micro hole drilling, high-speed division of glass materials, and complex graphic cutting of silicon wafers.


Product advantages

Good beam quality, small focused spot, capable of achieving ultra-fine marking, and fast marking speed with high efficiency

Widely applicable materials, therefore the application range is wider, making up for the lack of infrared laser processing capability

The heat affected area is extremely small, and there will be no thermal effect or material burning problem
Pre installed high-precision practical multifunctional workbench, with multiple flexible screw hole positions for easy customization and installation of specialized fixture platforms
In terms of appearance design, a three door closed processing is adopted, and high-quality specialized filter protection organic glass is used to make a dedicated observation window, creating the ultimate machine protection performance
The cooling system adopts water cooling, ensuring the characteristics of long service life, stability, and reliable operation of the laser


Working environment requirement

The ambient temperature requirement is between 18-35 ℃
The humidity requirement is<>
There should be no strong electromagnetic signal interference near the installation equipment. Avoid infinite power transmission stations around the installation site
Foundation amplitude: less than 50um; Vibration acceleration: less than 0.05g Avoid having a large number of stamping and other machine tools nearby
The equipment space requirements should ensure smoke-free and dust-free environments, avoiding working environments with severe dust such as metal polishing and grinding

Air pressure: 86-106kPa,Anti static flooring should be installed in certain environments to enhance shielding
The water quality of working cooling circulating water has strict requirements, requiring the use of pure water, deionized water or distilled water. Liquids containing high metal ions or other minerals such as tap water and mineral water cannot be used






◆ High end electronic product exterior logo identification
Food, PVC/pharmaceutical packaging materials (HDPE, PO, PP, etc.) are labeled and microporous with a pore size of d ≤ 10 μ m
Marking and cutting of flexible PCB boards
Removal of metal or non-metal coatings.
Silicon wafer micro hole and blind hole processing



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